Samsung's 32 Gb DDR4 memory chip has been demonstrated

Samsung recently began testing its 32-gb DDR4 memory chip, and the new densification will make it easier for DRAM manufacturers to produce high-capacity memory modules.Samsung's 32-gb a-die ddr4-2666 chip consists of two stacked 16-gb DDR4 chips, produced using the company's 10-nanometer technology.

Samsung offers two versions of the 32-gb DDR4 package: a 2G x8 architecture and a 1G x16 architecture.The former is treated as two DRAM memory devices by the memory controller, while the latter is treated as one device.DDP(double chip package) adopts standard 78 or 96 ball FBGA outline size and USES 1.2v industry standard voltage.

The JEDEC DDR4 specification describes only 4, 8, and 16 Gb memory devices.Therefore, DRAM manufacturers must use more advanced packaging technologies to build chips for high-capacity memory modules for servers or workstations.The DDP isn't particularly new, but the 32-gb ddr4-2666 DDP is unique to samsung.

The 32-gb DDR4 memory chip will enable module and PC manufacturers to use fewer DRAM chips to build high-capacity solutions for applications requiring high memory density or small external dimensions.Obviously, the dual-column memory module still needs memory controller support, but at least it's easier to build high-capacity memory subsystems using these chips.

Samsung did not disclose the pricing of its 32gb ddr4-2666 DDP, but it is clear that they will be sold at a higher price because they can only be obtained from samsung and they are more difficult to build than the SDP.