203M212-19B07-12

203M212-19B07-12

$98.13


Descripción :
CONN BACKSHELL ADPT SZ 7 12 12S
Cantidad :
15956

Disponibilidad en tiempo real

´Stock: 15956 Puede ser enviado

1+: $ 98.13
10+: $ 96.17
100+: $ 94.24
500+: $ 92.36
1000+: $ 90.51
ManufacturerTE Connectivity AMP Connectors
Series
Part StatusActive
TypeBackshell, Heat Shrink Adapter
Cable Opening-
Diameter - Outside0.854" (21.70mm)
Shell Size - Insert7, 12, 12S
Thread Size3/4-20 UNEF
Cable Exit90°
MaterialAluminum Alloy
PlatingCadmium
ShieldingShielded
ColorOlive Drab
FeaturesTermination Ring
Ingress Protection-
Includes-
Material Flammability Rating-
For Use With/Related ProductsMIL-C-5015G MS3400 Series, MIL-C-81703 Series III, MIL-DTL-26482 Series II, MIL-DTL-83723 Series I, III

New and Original electronic components 203M212-19B07-12 from TE Connectivity AMP Connectors Huge inventory, fast shipment, Tenco electronics website accept order online、BOM list quotation, and accept various payment term. Right now register as our member,you can get lots of discounts. For any inquiry, welcome to send email to us, or leave a message.

Electronic components customers

Tenco Technology Co.,Ltd, is a global electronic components distributor. Our company distribute many famous brands like Maxim、Linear、ADI、XILINX、Altera、Microchip、ST、TI、Cypress、Samsung etc...meanwhile we expert to provide Obsoleted、 ic chips. Based on our high quality products, best service, we win the trusts from customes all over the world. Now Tenco have sufficient stock items, Tenco has maintained a multi-faceted cooperation of stability, trust, mutual support and win-win business with many high-tech manufacturers, scientific research institutions and domestic and foreign trading company.
With the professional knowledge, all employees of Tenco provide satisfactory services to our customers with the most enthusiastic attitude and the fastest speed! "Service" is our eternal commitment, "Customer satisfaction, customer trust" is our goal, we make unremitting efforts to become your trustable partner.

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