The DA740x provides excellent active noise reduction, no matter how noisy the environment is.Provides twice as much audio quality as competing products and consumes only half as much power.
Beijing, China, on May 29, 2019 - a highly integrated power management, audio, AC/DC power conversion, charging and bluetooth low energy technology suppliers Dialog semiconductor company (German stock exchange transaction code: DLG) announced today that has introduced the industry's best performance of active noise control (ANC) highly integrated audio codec chip DA740x, for the rapid growth of wireless headset market to provide the best audio performance is not subject to any environmental impact.
The global wireless headset market is expected to grow at a compound annual rate of 20 percent and generate about $34 billion in revenue by 2024.With active noise reduction fast becoming the DE facto standard, Dialog expects to gain significant market share with its DA740x product line.
The DA740x series supports feedforward and feedback active noise reduction topologies, where the noise reduction microphone is located outside or inside the headphone cavity.With its integrated custom filtering capabilities, the DA740x also supports full hybrid mode, combining the best of both fields to provide high performance active noise reduction with optimal audio quality and maximum battery life.The chip family is independent of the audio interface type, which means it can be used in both wired and wireless applications.
The DA740x's digital implementation and software-based complementary tuning tools help Dialog customers achieve active noise-reduction design with fewer external components and speed up product launches, compared to typical analog based designs.Analog - based design requires a lot of analog circuit and element - level tuning.
"This groundbreaking new audio codec family is expected to significantly increase Dialog's share of the growing wireless headset market," said Sean McGrath, senior vice President and general manager of Dialog semiconductor's connectivity and audio technology business.The highly integrated design approach provides our customers with superior active noise reduction performance and audio quality, while using fewer external components and a board size smaller than 6 mm2, making it equally suitable for the smallest in-ear headphones.The DA740x helps manufacturers create higher-quality, lower-power products in smaller sizes, while speeding up their product rollout."
The series includes the following three chips:
·DA7402: stereo high performance codec with active noise reduction
·DA7401: monophonic high performance codec with active noise reduction
·DA7400: stereo high performance codec
Dialog has specially designed each of the above chips to meet the needs of different fields in the headphone market, providing one-stop procurement services for customers and helping them optimize the entire high-end product range.
The DA7402 supports hybrid, feedforward, and feedback topologies, up to 35 dB suppression, and provides dedicated calibration and tuning tools to support digital active noise reduction.The DA7402 has high performance playback and recording paths, providing high dynamic range and minimum latency.The DA7402 is one of the smallest digital active noise reduction codecs on the market, consuming half the power of today's leading chip solutions and doubling the audio performance, making it an ideal choice for sports headphones, smart ear devices, true wireless stereo (TWS) headphones, unified communications headphones and more.
A derivative of the DA7402, the DA7401 is a high performance mono active noise reduction codec designed for TWS headphones and intelligent ear devices.It provides 115 dB dynamic playback range, 103 dB dynamic recording range, hybrid active noise reduction and flexible clock architecture.The DA7400 is designed for consumer applications that require high resolution, high performance audio, providing similar functionality without active noise reduction.
Dialog shows the DA740x series during Computex 2019 at the Taipei international convention center on May 29.